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Packaging Research in Electronic Energy Systems

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Permalink to:Facility

Facility

Posted on July 15, 2015By preeswp
Permalink to:Attending the 30th Anniversary

Attending the 30th Anniversary

Posted on August 10, 2015By preeswp
Permalink to:Substrate Bonding

Substrate Bonding

Posted on July 15, 2015By preeswp

Confronting the World's energy challenges through R&D

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Research Focus and Strategy

PREES is committed to advancing knowledge through rigorous study and exploration of implementations for tomorrows wide bandgap SiC and GaN devices

Power-Electronics Package Prototyping

Rapid prototyping and strong partnerships foster quicker R&D  Industry and research partnerships are utilized to facilitate rapid power package prototyping and design.  The PREES Lab itself has processes to etch DBC, 3-D print conductive interconnects and package encasements, embed thermal cooling, mount Read More ...

Simulations and Modeling

An accurate and inexpensive first step in Power Electronics Design One of the important aspects of the research we are doing here at the PREES Lab is the high end simulations of the power electronics we produce.   Our capabilities include Read More ...

Comprehensive Education Programs

Education is the key to future development An integral piece of the PREES Lab mission is the education of the next generations high-tech workforce.  Education is available at both the undergraduate and graduate level.  We offer an exploration of electronics Read More ...

Advanced Electrical Testing

Using R&D to solve the world’s energy crisis Electrical testing and characterization is a very fundamental aspect of the PREES Lab.  A primary research thrust is to develop an electronics package that is characterized and available for applications in all Read More ...

  

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  • Home
  • Sponsors and Supporters
  • Academic
    • Comprehensive Education Programs
  • C a p a b i l i t i e s
    • Equipment
  • R e s e a r c h
    • Advanced Electrical Testing
    • Power-Electronics Package Prototyping
    • Simulations and Modeling
  • O v e r v i e w
    • People
    • Location
  • Contact Us