Lab Director
Dr. Douglas Hopkins
Areas of Research:
Very high frequency and high density power electronics. Extreme environment electronics, and solid state protection. Organic circuits in power electronics. High temperature(>300˚C) metal-matrix composite packaging with integrated ceramics
[email protected] 919- 513-5929
Dr. Iqbal Husain
Areas of Research:
Control and modeling of electrical drives, design of electric machines, power conditioning circuits, grid synchronization, and modeling of electric and hybrid vehicle systems.
[email protected] 919-593-5927
Dr. Ola Harrysson
Areas of Research:
Additive manufacturing: bio-medical applications, product development, and manufacturing processes. Current head of the Additive Manufacturing Lab.
[email protected] 919-513-0220
Dr. Jacob Adams
Areas of Research:
Novel materials and fabrication methods for multi-functional, conformal, and flexible microwave devices. Application of eigendecomposition techniques for antenna modeling/design.
[email protected] 919-513-1141
Yang Xu PhD Student
Areas of Research:
Multi-physics simulations and device packaging. Topology development.
Haotao Ke PhD Student
Areas of Research:
Additive manufacturing and true 3D printing of electronic circuits.
Adam Morgan PhD Student
Areas of Research:
Device packaging, interconnect and wire bonding technologies.
Xin Zhao PhD Student
Areas of Research:
Device packaging, metallurgical processes and bonding processes.
Sean Ketring Undergraduate Student
Areas of Research:
Renewable Energy Systems, project management and process development. Robotics.